 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| SMM4F High junction temperature TransilTM Features Typical peak pulse power: - 400 W (10/1000 s) - 2.4 kW (8/20 s) Stand off voltage range: from 5 V to 33 V Unidirectional types Low leakage current: - 0.2 A at 25 C - 1 A at 85 C Operating Tj max: 175 C JEDEC registered package outline RoHS package Halogen free molding compound K STmite flat (DO222-AA) A Complies with the following standards IEC 61000-4-2 level 4: - 15 kV (air discharge) - 8 kV (contact discharge) MIL STD 883G-Method 3015-7: class3 - 25 kV (human body model) Description The SMM4F Transil series has been designed to protect sensitive equipment against electro-static discharges according to IEC 61000-4-2, MIL STD 883 Method 3015, and electrical over stress such as IEC 61000-4-4 and 5. They are generally for surges below 400 W 10/1000 s. This planar technology makes it compatible with high-end equipment and SMPS where low leakage current and high junction temperature are required to provide reliability and stability over time. Their low clamping voltages provide a better safety margin to protect sensitive circuits with extended life time expectancy. Packaged in STmite flat, this minimizes PCB space consumption (footprint in accordance with IPC 7531 standard). TM: Transil is a trademark of STMicroelectronics December 2007 Rev 2 1/10 www.st.com 10 Characteristics SMM4F 1 Characteristics Table 1. Symbol VPP PPP P IFSM Tstg Tj TL Absolute ratings (Tamb = 25 C) Parameter Peak pulse voltage (IEC 61000-4-2 contact discharge) Peak pulse power dissipation (1) Value 30 400 2.5 30 -65 to +175 -55 to +175 260 Unit kV W W A C C C Tj initial = Tamb Tamb = 125 C tp = 10 ms Tj initial = Tamb Power dissipation on infinite heatsink Non repetitive surge peak forward current for unidirectional types Storage temperature range Operating junction temperature range Maximum lead temperature for soldering during 10 s 1. For a surge greater than the maximum values, the diode will fail in short-circuit. Table 2. Symbol Rth(j-l) Rth(j-a) Thermal resistances Parameter Junction to leads Junction to ambient on PCB with recommended pad layout Value 20 C/W 250 Unit Table 3. Symbol VRM VBR IR VCL IRM IPP T VF RD Electrical characteristics - parameter definitions (Tamb = 25 C) Parameter Stand-off voltage Breakdown voltage Breakdown current Clamping voltage Leakage current @ VRM Peak pulse current Voltage temperature coefficient Forward voltage drop Dynamic resistance IPP VCL VBR VRM IRM IR VF V IF I 2/10 SMM4F Table 4. Electrical characteristics - parameter values (Tamb = 25 C) IRM max@VRM Type 25 C 85 C A SMM4F5.0A SMM4F6.0A SMM4F6.5A SMM4F8.5A SMM4F10A SMM4F12A SMM4F13A SMM4F15A SMM4F18A SMM4F20A SMM4F24A SMM4F26A SMM4F28A SMM4F33A 10 10 10 10 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 50 50 50 50 1 1 1 1 1 1 1 1 1 1 V min VBR @IR(1) typ max V mA Characteristics VCL @IPP RD(2) VCL @IPP RD(2) 10/1000 s 10/1000 s 8/20 s 8/20 s max V 9.2 A 43.5 0.047 0.076 0.093 0.141 0.187 0.259 0.309 0.335 0.436 0.600 1.00 1.18 1.34 1.76 max V A 0.04 0.04 0.04 0.07 0.09 0.12 0.13 0.19 0.27 0.33 0.47 0.51 0.62 0.87 T(3) max 10-4/C 5.7 5.9 6.1 7.3 7.8 8.3 8.4 8.8 9.2 9.4 9.6 9.7 9.8 10.0 5.0 6.46 6.80 7.14 10 13.4 174 13.7 170 14.5 160 19.5 124 21.7 106 25.3 91 27.2 85 32.5 71 39.3 59 42.8 54 50 46 6.0 6.65 7.00 7.35 10 10.3 38.8 6.5 7.13 7.50 7.88 10 11.2 37.5 8.5 9.5 10.0 10.5 1 1 1 1 1 1 1 1 1 1 1 14.4 27.7 17.0 23.5 19.9 20.1 21.5 18.6 24.4 16.4 29.2 14.0 32.4 12.0 38.9 42.1 45.4 53.3 9.5 9.0 8.0 7.0 10 11.4 12.0 12.6 12 13.3 14.0 14.7 13 14.3 15.0 15.8 15 17.1 18.0 18.9 18 20.9 22.0 23.1 20 22.8 24.0 25.2 24 26.6 28.01 29.4 26 28.5 30.0 31.5 28 31.4 33.0 34.7 33 37.1 39.0 41.0 53.5 43 59.0 39 69.7 33 1. Pulse test: tp <50ms. 2. To calculate maximum clamping voltage at other surge currents, use the following formula VCLmax = RD x IPP + VBRmax 3. To calculate VBR versus junction temperature, use the following formula: VBR @ Tj = VBR @ 25 C x (1 + T x (Tj - 25)) Figure 1. Definition of IPP pulse %IPP 100 Repetitive peak pulse current tr = rise time (s) tp = pulse duration time (s) 50 0 tr tp t 3/10 Characteristics SMM4F Figure 2. Peak power dissipation versus initial junction temperature Figure 3. Peak pulse power versus exponential pulse duration (Tj initial = 25 C) 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 PPP[T j initial] / PPP[T j initial = 2 5 C] 10.0 PPP(kW) Tj initial = 25 C 1.0 Tj initial (C) 0.1 tp(ms) 125 150 175 200 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 0 25 50 75 100 Figure 4. Clamping voltage versus peak pulse current (exponential waveform, maximum values) IPP(A) 1000 Tj initial=25 C SMM4F5.0A SMM4F15A 100 SMM4F24A SMM4F33A 10 1 tp = 8/20 s tp = 10/1000 s VCL(V) 0 0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 4/10 SMM4F Characteristics Figure 5. Junction capacitance versus reverse applied voltage (typical values) Figure 6. Peak forward voltage drop versus peak forward current (typical values) 10000 C(pF) F=1 MHz VOSC=30 mVRMS Tj=25 C 1.0E+02 IFM(A) 1.0E+01 1000 SMM4F5.0A Tj =125 C SMM4F15A SMM4F24A 1.0E+00 100 SMM4F33A 1.0E-01 Tj =25 C VR(V) 10 1 10 100 VFM(V) 1.0E-02 0.0 0.5 1.0 1.5 2.0 2.5 3.0 Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (printed ciruit board FR4, SCu = 1 cm2) Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, eCu = 35 m) 1.00 Zth(j-a)/Rth(j-a) On recommended pad layout 200 180 160 Rth(j-a)(C/W) 0.10 140 120 100 80 0.01 tp(S) 0.00 1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03 60 40 0.0 0.2 0.4 0.6 0.8 SCU(cm2) 1.0 1.2 1.4 1.6 1.8 2.0 2.2 Figure 9. Leakage current versus junction temperature (typical values) 1.E+04 IR(nA) 1.E+03 VBR11.7V 1.E+02 1.E+01 VBR>11.7V 1.E+00 Tj(C) 1.E-01 25 50 75 100 125 150 VR=VRM 175 5/10 Ordering information scheme SMM4F 2 Ordering information scheme Figure 10. Ordering information scheme SM Surface Mount Package M = STmite package Surge rating 4F = 400 W in flat package Stand off voltage example - 12 = 12 V Type A = Unidirectional M 4F xx A - TR Packaging TR = Tape and reel 6/10 SMM4F Package information 3 Package information Case: JEDEC DO-222AA molded plastic over Planar junction Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: For unidirectional types the band indicates cathode. Flammability: Epoxy is rated UL94V-0 RoHS package In order to meet environmental requirements, ST (also) offers these devices in ECOPACK(R) packages. ECOPACK(R) packages are Lead-free. The category of second level Interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 5. STmite flat dimensions Dimensions Ref. Millimeters Min. E1 L L1 Inches Min. Typ. Max. Typ. 0.85 0.55 0.85 0.15 1.90 3.80 2.95 0.55 2.40 0.60 0.35 Max. 0.95 0.65 1.00 0.25 2.05 3.90 3.10 0.80 2.60 0.75 0.50 A L2 0.80 0.40 0.70 0.10 1.75 3.60 2.80 0.50 2.10 0.45 0.20 0.031 0.033 0.037 0.016 0.022 0.026 0.027 0.033 0.039 0.004 0.006 0.009 0.069 0.075 0.081 0.142 0.150 0.154 0.110 0.116 0.122 0.020 0.022 0.031 0.083 0.094 0.102 0.018 0.024 0.030 0.008 0.014 0.020 b D b b2 b2 c D E E1 L L1 L2 L3 E L3 c A Figure 11. STmite flat footprint dimensions 0.85 0.63 (0.033) (.025) Figure 12. Marking information 2.00 (0.079) 0.65 (.026) Cathode bar (unidirectional devices only ) (0.026) 0.65 (0.037) 0.95 1.95 (0.077) 4.13 (0.163) y ww xxx Y: Year WW: week XXX: Marking millimeters (inches) 7/10 Package information Table 6. Marking Type SMM4F5.0A-TR SMM4F6.0A-TR SMM4F6.5A-TR SMM4F8.5A-TR SMM4F10A-TR SMM4F12A-TR SMM4F13A-TR SMM4F15A-TR SMM4F18A-TR SMM4F20A-TR SMM4F24A-TR SMM4F26A-TR SMM4F28A-TR SMM4F33A-TR Marking 4UA 4UB 4UC 4UD 4UE 4UF 4UG 4UH 4UJ 4UK 4UM 4UN 4UO 4UQ SMM4F 8/10 SMM4F Ordering information 4 Ordering information Table 7. Ordering information Marking See Table 6. Package STmite flat Weight 16.7 mg Base qty 12000 Delivery mode Tape and reel Order code(1) SMM4FXXA-TR 1. xx indicates stand-off voltage 5 Revision history Table 8. Date 29-Nov-2007 19-Dec-2007 Document revision history Revision 1 2 First issue. Updated IPP and RD parameters in columns 10 and 11 of Table 4. Changes 9/10 SMM4F Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2007 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 10/10 |
Price & Availability of SMM4FXXA-TR
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |